Supply ChainJun 10, 2026, 11:49 PM· South Korea
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
Summary
After months of testing, Google has placed an order with Intel to package more than 3 million of its TPUs in 2028. Meanwhile, SK hynix is testing Intel's EMIB packaging technology for HBM integration. This marks a significant customer win for Intel's advanced packaging business and could reshape the AI chip supply chain.
Why it matters
This event shows Intel's advanced packaging technology gaining recognition from two key customers, Google and SK hynix, with significant implications for AI chip manufacturing and HBM supply chain.
Source links
- https://www.tomshardware.com/tech-industry/google-reportedly-books-intel-for-more-than-3-million-tpus-in-2028
- https://news.google.com/rss/articles/CBMirgFBVV95cUxQX1RJQjgzTUNMdmpxMWJPVFhVSHdGa2VabkZybzFvdUMxaklLUkp2dWs2TU9sMUU3VjR1OUQtZVZlQ19iYlJoUDEzb1BvcDI4SlpQTHBqR29LcERaLXFIMXhndVVjd3c2b3lfWmxPLXRNZUZmNWJQd29GSUtLaDdncDZnc19xYkVadl8teWFUOUdnaFhlRE1CZ3VWd0U0ZUh2TjlVNnNIS0FITU1BaWc?oc=5
Market reaction
Intel
NASDAQ · INTC
SK hynix
KRX · 000660